Dymek Receives Purchase Order for EVG Wafer Bonder

Shanghai, China - September 2009 - EVG holds the dominant market share from manual to fully automated wafer bonders and has installation bases of more than 500 chambers.

Utilizing high-contact forces under elevated temperatures and a controlled atmosphere, this novel approach is today's process standard.

EVG Bonders can be widely used for manufacturing and R&D in many fields such as semiconductor, TSV, MEMS and advanced packaging.

• Dongguan, China - April 2009
  DYMEK Receives Purchase Order for Filmetrics Tabletop Thin Film Measurement System
  Tabletop Thin Film Measurement System supplied by Filmetrics work in thin film...
  
  
• Dongguan, China - March, 2009
  DYMEK Receives Purchase Order for Filmetrics Tabletop Thin Film Measurement System
  Tabletop Thin-film Measurement System F20-HC supplied by Filmetrics...
  
  
• Singapore, 12-13 March, 2009
  DYMEK Participates in the DISKCON Asia-Pacific 2009
  Dymek participates in IDEMA's two-day conference and trade show titled: Facing the Challenges Through Innovation.
  
  
• Dongguan, China - January, 2009
  DYMEK Receives Purchase Order for EVG Mask Aligner
  The EVG Mask aligners handle sizes of substrates starting from less than 5 mm up to 150 mm and from 3 inches up to 200 mm...