CMP & Wafer Backside Grinder

 

MAT stands for Machine, Application and Tools. MAT proposes “Total Solution” to meet customers’ requirements. MAT manufactures CMP, Grinder, Lapping and Polishing system for R&D Facilities to Industrial Mass Production. MAT also established a joint venture company in Shanghai, China called “Shoshin Semicon Equipment (SSE)”. MAT designs a Back Side Grinding Machine. SSE manufactures this tools in China with MAT technical advises. This is a Fully Automated Back Side Grinding Machine. It is suitable for 4” to 8” wafer. It contains dual spindles, three chuck tables and in process gage. Demo test is available in Shanghai Laboratory.