SST – Programmable Vacuum Solder Reflow Furnace Model 3130

 

With using SST tools, customers shall enjoy the perfect soldering processes --- void free, flux free, high yield (99%+) , flexibility for different type of sample materials ( e.g. glass-to-metal package seal, GaAs die with sub-mount …etc.) , controllable moisture level & inert gas inside of hermetic package & MEMS package. SST International Corp. are enable to provide the turnkey solution for soldering processes including soldering equipment, soldering recipe, custom design tooling and high precision graphite machining service. Please visit www.sstinternational.com for details.

 

Model 3130 :

 

• Temp. range : RT ~ 500 deg C (1,000 deg C as option)
• Chamber area : 225 cm2
• Vacuum range : 50 mtorr
• Max. process gas pressure : 50 psig
• Applications: Flux-Free Soldering、Fiber Optics Package Assembly、MMIC Die Attach、Power Device Assembly、 Hermetic Package Sealing、Hybrid Assembly、Glass-To-Metal Sealing、Medical Device Assembly、 BGA Solder Ball Bumping、Die, Component and Substrate Solder Attach