AXIC - RIE, PECVD, Plasma System

 

The BenchMark 800-III® Inductively Coupled Plasma (ICP) Processing System from AXIC, Inc. defines a new concept in Deep Reactive Ion Etch (DRIE) and low temperature-low damage Plasma Enhanced Chemical Vapor Deposition (ICP PECVD) plasma processing. The system is based on a modular design starting with a universal chamber and cabinet unit with ICP etch and deposition
bottom electrodes available for easy installation into the chamber unit. We are confident you will find the ease of use, variety of plasma processes, serviceability and attractive pricing of the BENCHMARK 800-III® unsurpassed by any other plasma product in the market.

 



AXIC BENCHMARK 800-II