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AXIC - RIE, PECVD, Plasma System |
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The BenchMark 800-III® Inductively Coupled Plasma (ICP)
Processing System from AXIC, Inc. defines a new concept in Deep Reactive Ion
Etch (DRIE) and low temperature-low damage Plasma Enhanced Chemical Vapor
Deposition (ICP PECVD) plasma processing. The system is based on a modular
design starting with a universal chamber and cabinet unit with ICP etch and
deposition
bottom electrodes available for easy installation into the chamber unit. We
are confident you will find the ease of use, variety of plasma processes,
serviceability and attractive pricing of the BENCHMARK 800-III® unsurpassed
by any other plasma product in the market. mf
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AXIC BENCHMARK 800-II |
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Tamarack - Photolithography System |
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Tamarack’s line of large area proximity mask aligners
offers non-contact photolithography to greatly minimize contact related
problems, such as repeated defects. Proximity gapping (separation between
the mask and the substrate) can be varied to accommodate various process
applications. These aligners are designed to transfer the full image of the
mask in a single exposure, thus maintaining high throughput levels. Precise
image transfer is assured with Tamarack’s large area collimated light
sources. Tamarack's Model 152 is a manual
alignment, Collimated UV Proximity Exposure system for accurate pattern
replication. This unit is unique in its ability to provide proximity, soft
contact and vacuum contact imaging. Compared to conventional contact
printing, proximity printing reduces the yield issues associated with mask
damage and allows the use of stable glass artwork. Precise optical alignment
of large photoresist coated ceramic, glass, silicon or P.C. board substrates
is easily accomplished with the Model 152R Mask Alignment and Exposure
System.
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Tamarack 152 |
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