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Veeco (IBD/FCA) - DLC System |
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The norm for
critical dimensions (CDs) in leading edge magnetic recording head structures
is already about, or less than 100 nm. With the continued tightening of
manufacturing tolerances for head fabrication, lift-off processing must
increasingly contend with nanofabrication issues such as film shape at
structure edges, nanometer surface roughness, and ultimately the bottom line -
yield.
Veeco has recognized these trends and has led in reengineering film deposition
processes for magnetic head fabrication. It describes improvements in Veeco's
NEXUS® Ion Beam Deposition System and methods that achieve
significantly increased manufacturing yield in thin film head structures for
giant magneto resistance (GMR), tunneling magnetoresistance (TMR), and other
high areal density head systems.
The NEXUS Diamond-Like Carbon
Deposition system deposits sub-30A hard, wear and corrosion-resistant slider
overcoats and landing pads. It is expandable to incorporate Filtered Cathodic
Arc (FCA) which provides significant improvement to coating hardness for next
generation manufacturing requirements.
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Veeco NEXUS IBD
Veeco NEXUS DLC |
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Veeco (NEXUS) - IBE System |
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Veeco's NEXUS Ion Beam Etching system is ideal
for wave guide, laser facets and contact / lead etch applications. This
system has the ability to etch III-V compounds, LiNbO3 and SiO2, offering
highly selective etching through reactive processing (RIBE and CAIBE). High
yields are achieved due to temperature control and ESD control. The system
also provides fine end point control and maximum sidewall and roughness
control. With excellent uniformity and run-to-run repeatability Veeco's
NEXUS Ion Beam Etching system is capable of meeting all of our customers
opto electronic device processing requirements.
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Veeco NEXUS IBE |
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Veeco (Slider) - Lapping/Dicing System |
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Veeco Aii provides the industry's most accurate and controllable lapping and
dicing products for data storage and semiconductor applications.
Robo6.2D®
(third generation Robo6® machine) is a two-head lapping system which uses a
massive casting for the frame. At the end of the lapping operation the lap
heads lift under computer control and the doors open automatically (doors
protect the operators from the rotating planetary lap heads). The lap heads
move out to the front of the machine and tilt upward for each load and
unload.
Veeco MTI is known worldwide as a leading-edge manufacturing company,
dedicated to the design and production of state-of-the-art, high
performance, ultra precision machine systems for slicing, slotting, dicing,
grinding and lapping operations.
NSX250i - The Ultimate Dicing Engine: For enhanced productivity and
precision, the NSX250i combined with MTIVision™ 3D Alignment and Windows
based software delivers the utmost in performance and flexibility. A proven
performer in the data storage industry since 1995, the NSX250i’s robust
design and unique overarm spindle support is recognized as the ultimate
dicing engine for hard, brittle ceramic substrates and wafers.
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Veeco Aii Robo6.2D
Veeco MTI NSX250i |
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LESCO - UV Curing System |
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| LESCO - the leading manufacturer of highest intensity, precision UV curing
systems & UV curable materials.Our spot cures, conveyorized UV & IR
curing systems and other products are used pervasively in medical device
manufacturing, electronics, disk drives, automated assembly, fiber optics,
lens manufacturing, and a wide array of industrial and commercial
applications.
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LESCO Super Spot MAX |
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OSC - Automated System |
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Optical Systems Corporation (OSC) designs and manufactures high performance
production systems for the Fiberoptics/Telecommunications and Data Storage
Industries. OSC's innovative technologies are integrated with precision
optics and mechanics, machine vision, motion control, image processing and
application specific software to provide cost effective solutions to your
application.
The Automatic Pole Tip Inspection (APTI)
Station provides critical measurement information and analysis of potential
pole defects. This information is utilized to sort good heads from those not
meeting the minimum specification. Measurement and defect data can be
presented per your manufacturing process requirements enabling vital part
sorting capabilities.
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OSC Automatic Pole Tip Inspection System |
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Palomar - Gold Ball Bonder |
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The Gold Connection is an integrated solution that addresses the industry's
growing need for smaller package density, increased reliability, and
increased signal performance, while providing a clean, environmentally safe
alternative to lead-based processes. The Gold Bumper produces gold wire ball
bumps for flip chip applications. Using standard 1 mil gold wire in a
process similar to wire bonding, the Gold Bumper creates planarized,
tailless bumps in a consistent, repeatable, single-step process with up to
5-micron placement accuracy. Planarity and a consistent top surface area on
each bump provide ideal connectivity and attachment for flip chip
applications.
Palomar's Gold Bumper provides the flexibility to quickly and easily
change the ball array, position, and bump shape to match the desired attach
process. Because of the Gold Bumper's unique tool motion capabilities that
can shear the top of the bump without leaving a tail, a flat top can be
obtained without the need for a separate coining machine or process, saving
process time and cost. Gold bumps, bonded to a wafer or die, create the
first step towards a solderless interconnect solution.
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Palomar Gold Bumper |
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WestBond - Wire & Die Bonder |
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WestBond has designed and manufactured a renowned line of wire bonding and
die attach machines, wire pull and shear test equipment, ultrasonic
components, and accessories for the microelectronics packaging industry.
WestBond is perhaps best known for our patented single input X-Y-Z
micromanipulator. This unique mechanism of our manual and semi-automatic
series machines provides exceptional ease of operation and versatility of
application. It accepts the inputs at which humans excel, and continues with
the execution of programs of user data under operator and/or digital motor
control. In our automatic series machines, data input is via a graphical
user interface, and alignment verification is by optical pattern
recognition.
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WestBond Wire Bonder |
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