Formed in 1978, SST International has long been recognized by the microelectronics industry as a world leader in package assembly. It shows in the expertise with which we design and build vacuum / pressure furnaces for the solder reflow assembly of high reliability microelectronics components. And in the face that more than 1,200 of these state-of-the-art furnaces have been installed at over 400 customer sites around the world.
With using SST tools, customers shall enjoy the perfect soldering processes --- void free, flux free, high yield (99%+) , flexibility for different type of sample materials ( e.g. glass-to-metal package seal, GaAs die with sub-mount .etc.) , controllable moisture level & inert gas inside of hermetic package & MEMS package. SST International Corp. are enable to provide the turnkey solution for soldering processes including soldering equipment, soldering recipe, custom design tooling and high precision graphite machining service. Please visit http:// www.sstinternational.com for details.
Model 3130
• Temp. range : RT ~ 500 deg C (1,000 deg C as option)
• Chamber area : 225 cm2
• Vacuum range : 50 mtorr
• Max. process gas pressure : 50 psig
• Applications: Flux-Free Soldering ? Fiber Optics Package Assembly ? MMIC Die Attach ? Power Device Assembly ? Hermetic Package Sealing ? Hybrid Assembly ? Glass-To-Metal Sealing ? Medical
Device Assembly ? BGA Solder Ball Bumping ?
Die, Component and Substrate Solder Attach
Model 3140 or 3150
• Temp. range : RT ~ 500 deg C (1,000 deg C as
option)
• Chamber area : 225 cm2
• Vacuum range : 10-6 torr ( can select Cryogenic Pump or Turbomolecular Drug Pump)
• Max. process gas pressure : 90 psig ( N2, Ar, He, Forming gas as option)
• Applications : MEMS ? Infrared Sensor ? Crystal Oscillator ? Hermetic ? Nobel Gas Miniature Lamp ? Military Electronic .such Package Sealing ? Getter Activation ? Wafer Level Package ? Void-Free Eutectic Die Attach
Model PF2400
- Designed for high volume production
- Chamber area : 840 inches
- Equip with three chambers , each area : 8.0 x 35.0 inches
- Closed cooling as option
- Temp. range : RT ~ 500 deg C (1,000 deg C as option)
- Vacuum Range : 10 m torr
- Max. process gas pressure : 50 psig
Model 1200
- Table-top model , specially designed for R&D and small volume production
