Tru-Si Technologies, Inc. provides atmospheric
downstream plasma (ADP) processing equipment to the semiconductor industry
in order to meet increasing wireless, portable, networking, and internet
market demands for smaller, thinner, cheaper, and more integrated electronic
devices. The equipment business is focused on providing total thinning
solutions for chip makers. Tru-Si provides atmospheric downstream plasma
(ADP) gas etching equipment, and the handling technology to enable flexible
integration of advanced silicon wafer thinning processes.
This dry etching process injects the reactant gas, typically CF4, through
an argon arc plasma to break it down to its constituent atoms. As these
atoms filter through air at atmospheric pressure, they become deionized, and
unwanted atoms react with the air, becoming inert. The result is an
efficient dry chemical etch without ion damage.
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