Imago's flagship product, the LEAP® Microscope is an innovative Atom Probe microscope, boasting the fastest data collection rate, largest field of view, and largest analysis volumes ever reported for an atom probe.

Schmitt Measurement Systems' flagship products the TMS 2000W-RC and TMS 3000W-RC are the ideal solution for many manufactures in the computer industry. These products provide fast, accurate, repeatable measurements for manufactures of silicon wafers, computer chips and memory devices. The system provides measurments to a few hundreths of an angstrom, a level unachievable by other testing devices.

 

Vacuum Instrument Corporation (VIC) is the world's largest company devoted solely to the research, design, manufacture, distribution, and service of leak detectors and complete leak detection solutions.
The MS-40 features a breakthrough in design technology combining high-test port pressure, a large capacity internal mechanical pump and VIC’s unique mass spectrometer. The MS-40 utilizes a 180-degree deflection dual magnetic sector mass spectrometer tube with built-in high vacuum ion gauge. Two long-life, low current filaments are provided. A self-cleaning heated repeller and automatic closed-loop emission control are at the heart of the MS-40 leak detector design. Heavy ion traps reduce the need for deionization of the mass spectrometer tube by an order of magnitude. This makes it at least four times faster than conventional portable units available today. Its speed makes the MS-40 ideal for a wide range of industrial applications. The mass spectrometer is sensitive to Helium Mass 3 or Mass 4 and is operator selectable.

CETR is the worldwide leading tribology equipment manufacturer, their most updated model eCP-4 is worldwide unique table-top type CMP machine which can operate both CMP & eCMP mode. The machine can widely use for research & development of CMP , eCMP processes and the related consumables. The computerized real-time motor-control and data-acquisition allows for a repeatable CMP process with crucial process parameters monitored and analyzed in-situ, real-time:

 

 1. Dynamic coefficient of friction between both wafer-pad and conditioner-    pad, changes ofwhich allow for evaluation of material removal rate and        non-uniformity of polishing,

2.  in-situ monitoring of current and voltage during eCMP mode,

3. energy and peaks of contact high-frequency acoustic emission, which         allow for detectionevaluation of polishing intensity and detection of micro-scratches and delamination,

4. process temperature in the slurry and on the pad,

5. pad wear during conditioning and/or polishing