From May 22nd to 23rd, 2024, the 2024 Conference on Advanced Semiconductor Technology Innovation, Development, and Opportunities opened at the Shishan International Convention Center in Suzhou. Dymek China, as an advanced semiconductor equipment distributor, was invited to participate in the conference and delivered an outstanding presentation.

The conference brought together numerous industry experts and leaders, featuring rich and insightful content. Dymek engaged in in-depth exchanges with experts, scholars, and entrepreneurs within the industry, jointly shared professional experiences, and discussed the latest technology trends, gaining valuable insights and inspiration!

At the seminar, Mr. Bu Xinping, General Manager of Dymek China, joined forces with Mr. Du Jialiang, North China Sales Manager of Presiss, to deliver a comprehensive and accessible presentation to the audience. They thoroughly explored the challenges in third-generation semiconductor manufacturing processes, and provided an insightful overview across three key technological areas: wafer bonding, non-destructive thin-film characterization, and wafer critical dimension inspection and sorting.

Mr. Bu Xinpeng first delivered an in-depth introduction to wafer bonding technology, covering various processes from high-temperature bonding to low-temperature plasma activation. He not only explained the diversity and complexity of wafer bonding techniques but also emphasized their pivotal role in modern semiconductor manufacturing. He then shared the latest advancements in non-destructive thin-film characterization (film thickness measurement), offering the audience a fresh understanding of how rapid and accurate measurements can be achieved for films ranging from sub-nanometer to 3 millimeters in thickness.

Following this, Mr. Du Jialiang focused on wafer critical dimension inspection and sorting technology. He provided a detailed introduction to the Orzew FC20/FC20X fully automated inspection system, a result of joint development between Dymek and Presiss. Mr. Du demonstrated the system’s significant advantages in enhancing inspection efficiency and accuracy, as well as how it ensures comprehensive control over wafer quality.

Bu Xinping, General Manager of Dymek China, was interviewed by the event organizer.