SEMI-e 6th Shenzhen International Semiconductor Exhibition opens at Shenzhen International Convention and Exhibition Center on June 26, 2024
As a distributor of advanced semiconductor equipment, Daimet China is honored to participate in this exhibition.
This exhibition brings together many industry experts and elites, and the content is wonderful and rich. Dymatic benefited from in-depth exchanges with experts, scholars and entrepreneurs in the same industry, sharing industry experience and discussing technology trends!
In addition to the exciting exhibition, a number of theme summits were held. In the “Semiconductor Industry Technology Summit”, “Third Generation Semiconductor Industry Development Summit Technology Forum” and “2024 China Automotive Semiconductor Conference”, experts and business executives from Huawei, Tinker Hektar, Beifang Hualong, the 45th Research Institute of China Electrotechnology Corporation (CEC), Great Wall Motors, the Research and Development General Hospital of Dongfeng Corporation (DFDC), Ziguang Experts and business executives from Tongchuang, Keyou Semiconductor, and Basic Semiconductor shared advanced semiconductor manufacturing and packaging technologies, as well as the latest SiC application solutions.
In recent years, third-generation semiconductor technology has emerged as a core driver in the semiconductor industry. As a participant in this field, we have accumulated extensive experience in various inspection and measurement needs for substrates and epitaxials. In order to better understand and meet the needs of our customers, we have had extensive and in-depth communication with many of them to discuss the application and development direction of various inspection and measurement technologies. During the exchanges, we focused on several key inspection areas, including film thickness measurement, wafer thickness measurement, wafer topography measurement, wafer bonding, photolithography, plasma cleaning, stress and sheet resistance measurement. Each of these inspection areas is critical and directly affects the performance and reliability of semiconductor devices.
Through these extensive and in-depth exchanges, we not only deepen our understanding of customer needs, but also promote the continuous optimization of our own technologies and solutions. We are always committed to providing our customers with better products and services to help the third generation of semiconductor technology to flourish.