The EVG ComBond high-vacuum wafer bonding platform marks a new milestone in EVG’s unique portfolio of wafer bonding equipment and technology in response to market needs for more sophisticated integration processes. The application areas supported by the EVG ComBond range from advanced engineered substrates, stacked solar cells and power devices to high-end MEMS packaging, high-performance logic and “beyond CMOS” devices. The modular cluster design of the EVG ComBond system allows for a highly flexible platform that can be tailored to various demanding customer needs both in R&D and high-throughput, high-volume manufacturing environments. The EVG ComBond facilitates the bonding of heterogeneous materials with different lattice constants and coefficients of thermal expansion (CTE) as well as the formation of electrically conductive bond interfaces by its unique oxide-removal process. The EVG ComBond high-vacuum technology also enables low-temperature bonding of metals, such as aluminum, that re-oxidize quickly in ambient environments. Void-free and particle-free bond interfaces and excellent bond strength can be achieved for many material combinations.
| Vacuum level |
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| Handling: < 7E-8 mbar |
| Processing: < 5E-8 mbar |
| Cluster configuration |
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| Process modules: min. 3, max. 6 |
| Loading: manual, cassette, EFEM |
| Optional process modules: |
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| Bond module |
| ComBond® Activation Module (CAM) |
| Bake module |
| Vacuum Alignment Module (VAM) |
| Wafer diameter |
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| Up to 200 mm |
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