Product Overview:
The ET200A, based on the Windows operating system, provides comprehensive surface morphology analysis for a wide range of materials, including semiconductor wafers, solar silicon wafers, thin-film heads and disks, MEMS, optoelectronic devices, precision-machined surfaces, biomedical components, thin films/chemical coatings, flat panel displays, and touch screens. It utilizes a diamond (hard probe) contact measurement method to achieve highly accurate surface topography analysis.
The ET200A reliably and precisely measures various surface morphology parameters, such as step height, roughness, waviness, wear depth, and thin-film stress.
Equipped with multiple types of probes, the system offers probe heads with controlled contact force and adjustable vertical range. The system also features a color CCD in-situ imaging design, allowing real-time observation of the probe’s working status for more accurate and convenient positioning of the test area.
| Max. sample size | φ160 × t 48 mm |
|---|---|
| Repeatability | 1 σ 0.3 nm or less |
| Measuring range | Z: 600 μm X: 100 mm |
| Resolution | Z: 0.1 nm X: 0.1 μm |
| Measuring force | 10 μN to 500 μN |
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