Softbake, post-exposure bake and hardbake steps can be performed on the EVG105 bake module. Controlled baking environment assures uniform evaporation and programmable proximity pins provide the best available control of resist hardening processes and temperature profiles.
| Wafer diameter (substrate size) |
|---|
| Up to 300 mm |
| Hotplate |
|---|
| Temperature range: ≤ 250 °C |
| Manual adjustment of lift pins to desired proximity gap |
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