The EVG301 semi-automated single wafer cleaning system employs one cleaning bowl. With manual loading and pre-alignment, the EVG301 is a versatile R&D-type system for flexible cleaning procedures. The EVG301 system can be combined with EVG’s wafer alignment and bonding systems to eliminate any particle prior to wafer bonding, or it can be combined with EVG’s debondig systems to remove the temporary bonding adhesive after debond.
| Wafer diameter (substrate size) |
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| 200, 100 – 300 mm |
| Cleaning system |
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| Open chamber, spinner and cleaning arm |
| Chamber: made of PP or PFA (option) |
| Cleaning media: DI-water (standard), other cleaning media (option) |
| Spinner chuck: vacuum chuck (standard) and edge handling chuck (option) made of metal ion free and clean materials |
| Rotation: up to 3000 rpm (in 5 sec) |
| Megasonic nozzle |
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| Frequency: 1 MHz (3 MHz option) |
| Output power: 30 – 60 W |
| DI-water flow rate: up to 1.5 liter/min |
| Effective cleaning area: Ø 4.0 mm |
| Material: PTFE |
| Megasonic area transducer |
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| Frequency: 1 MHz (3 MHz option) |
| Output power: max. 2.5 W/cm² active areas (max. output 200 W) |
| DI-water flow rate: up to 1.5 liter/min |
| Effective cleaning area: triangle shape that guarantees radio uniformity on whole wafers per each rotation |
| Material: SS and sapphire |
| Brush |
|---|
| Material: PVA |
| Programmable parameters: brush and wafer speed (rpm) |
| Adjustable parameters (brush compression, media dispense) |
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