The EVG320 automated single wafer cleaning system handles wafers and substrates automatically between the process stations. The robot handling system ensures pre-alignment and loading of the wafers automatically in a cassette-to-cassette or FOUP-to-FOUP operation.
| Wafer diameter (substrate size) |
|---|
| 200, 100 – 300 mm |
| Cleaning system |
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| Open chamber, spinner and cleaning arm |
| Chamber: made of PP or PFA (option) |
| Cleaning media: DI-water (standard), other cleaning media (option) |
| Spinner chuck: vacuum chuck (standard) and edge handling chuck (option) made of metal ion free and clean materials |
| Rotation: up to 3000 rpm (in 5 sec) |
| Megasonic nozzle |
|---|
| Frequency: 1 MHz (3 MHz option) |
| Output power: 30 – 60 W |
| DI-water flow rate: up to 1.5 liter/min |
| Effective cleaning area: Ø 4.0 mm |
| Material: PTFE |
| Megasonic area transducer |
|---|
| Optional |
| Frequency: 1 MHz (3 MHz option) |
| Output power: max. 2.5 W/cm² active areas (max. output 200 W) |
| DI-water flow rate: up to 1.5 liter/min |
| Effective cleaning area: triangle shape that guarantees radio uniformity on whole wafers per each rotation |
| Material: SS and sapphire |
| Brush |
|---|
| Material: PVA |
| Programmable parameters: brush and wafer speed (rpm) |
| Adjustable parameters (brush compression, media dispense) |
| Automated wafer handling system |
|---|
| The field proven class 1 compatible wafer handling robot on EVG®320 enables 24 hour automated cassette-to-cassette or FOUP-to-FOUP operation for the highest throughput. Surfaces in contact with wafers do not cause any metal ion contamination. |
| Optional features |
|---|
| ISO 3 mini-environment (according to ISO 14644) |
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