The EVG520 IS is well suited for small-volume-production applications. Redesign based on customer feedback and EV Group’s continuous technological innovations, the EVG520 IS features EV Group’s proprietary symmetric rapid heating and cooling chuck design. Advantages such as excellent temperature and force uniformity, high-force-bonding capability, and the same material and process flexibility as on manual systems contribute to the success of all wafer bonding processes.
| Max Contact Force |
|---|
| 10, 20, 60, 100 kN |
| Heater size | 150 mm | 200 mm |
|---|---|---|
| Minimum substrate dimension | single chips | 100 mm |
| Vacuum |
|---|
| Standard: 1E-5 mbar |
| Optional: 1E-6 mbar |
| Max. temperature (°C) |
|---|
| Standard: 550 |
| Optional: 650 |
| Single chips processing |
|---|
| Yes |
| Bond chuck system / Alignment system |
|---|
| 150 mm heater: EVG®610, EVG®620, EVG®6200 |
| 200 mm heater: EVG®6200, SmartView® NT |
| Active water cooling |
|---|
| Top and bottom |
| Power supply for anodic bonding |
|---|
| Max. voltage: 2 kV |
| Max. current: 50 mA |
| Loading chamber |
|---|
| Manual |
| Max. bond chambers |
|---|
| 2 |
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