The EVG560 automated wafer bonding system is a highly configurable production bonder. Based on the same bond chamber design and incorporating the key features of EVG’s manual bonding systems with enhanced process control and automation, the EVG560 bonder delivers high-yield production bonds. A robot handling system automatically loads and unloads the process chambers.
| Maximum heater size |
|---|
| 150, 200, 300 mm |
| Loading chamber |
|---|
| 5-axis robot |
| Max. bond modules |
|---|
| 4 |
By joining hands and leveraging cutting-edge technologies, we develop innovative solutions to drive societal progress and shape a better future.
With deep expertise and extensive experience, we deliver precise and efficient solutions to ensure every project meets the highest standards.
We integrate cutting-edge technology with continuous innovation to develop breakthrough solutions that drive industry progress and create lasting value for our clients.
We offer round-the-clock premium support services, ensuring rapid response and efficient problem resolution, allowing you to focus on your core business without worries.
