The EVG®610 is a compact and multi-purpose R&D system that can handle small substrate pieces and wafers up to 200 mm.
The EVG610 supports a variety of standard lithography processes, such as vacuum-, hard-, soft-, and proximity exposure modes, with the option of back-side alignment. Moreover the system offers additional capabilities including bond alignment and nanoimprint lithography (NIL). The EVG610 offers quick processing and re-tooling for changing user requirements with a conversion time of less than a few minutes. Its advanced multi-user concept can be adapted from beginners to expert level, thus making it ideal for universities and R&D applications.
Features
Technical Data
| Alignment modes |
| Top side alignment: ≤ ± 0,5 µm |
| Bottom side aligment: ≤ ± 2,0 µm |
| IR alignment: ≤ ± 2,0 µm/ substrate material depending |
| Bond alignment: ≤ ± 2,0 µm |
| NIL alignment: ≤ ± 2,0 µm |
| Exposure source |
| Mercury light source / UV LED light source |
| Wedge compensation |
| Fully automatic – SW controlled |
| Wafer diameter (substrate size) |
| Up to 100 / 150 / 200 mm |
| Exposure setup |
| Vacuum contact / hard contact / soft contact / proximity mode |
| Exposure options |
| Interval exposure / flood exposure / sector exposure |
| Advanced alignment features |
| Manual alignment / in-situ alignment verification |
| Manual cross correction |
| Large gap alignment |
| System control |
| Operation system: Windows |
| File sharing & back-up solution / unlimited no. recipes & parameters |
| Multi-language user GUI & support: CN, DE, FR, IT, JP, KR |
| Real-time remote access, diagnostics & troubleshooting |
| Nanoimprint lithography technology |
| UV-NIL |
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