The EVG770 NT is a versatile platform for step-and-repeat (S&R) nanoimprint lithography for efficient master fabrication or direct patterning of complex structures on substrates. This approach allows uniform replication of templates from small dies up to 30 cm². The S&R process allows to replicate those dies multiple times over large areas up to Gen2 panel-size substrates. In combination with diamond turning or direct writing methods, S&R imprinting is frequently used to efficiently fabricate masters required for wafer-level optics manufacturing or EVG’s SmartNIL process. Thus, it is often a crucial prerequisite for high volume manufacturing of augmented reality waveguides, optical sensors, diffractive optics, metasurfaces or biomedical devices.
Key features of the EVG770 NT include precise alignment capabilities, full process control and the flexibility to address process requirements of a wide variety of structures and materials.
| Available Substrate Size |
|---|
| 80 mm, 4”, 6”, 8”, 12”, Gen2 (370 mm x 470 mm) |
| Die-to-Die Positioning |
|---|
| < +/- 1 µm |
| Live Alignment |
|---|
| < +/- 250 nm |
| Max. Template Size |
|---|
| 80 mm x 80 mm |
| Active Imprint Area |
|---|
| 30 cm² |
| LED Exposure Optics Wavelength |
|---|
| 365 nm |
| Exposure Optics Intensity |
|---|
| > 300 mW/cm² |
| Dispense Viscosity Range |
|---|
| 100-10000 cp |
| Dispense System Material Compatibility |
|---|
| IPA, PGMEA, MEK, Acetone |
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