The EVG®850 DB is a fully automated debonder for the separation and cleaning of processed temporary bonding wafer stacks. The fragile device wafers are always supported either through film frame mounting or through a thin wafer handler.
| Wafer diameter (substrate size) |
|---|
| Up to 300 mm |
| Up to 12“ film frame |
| Configuration |
|---|
| Debond module |
| Clean module |
| Film frame mounter |
| Options |
|---|
| ID reading |
| Various output formats |
| High topography wafer handling |
| Warped wafer handling |
By joining hands and leveraging cutting-edge technologies, we develop innovative solutions to drive societal progress and shape a better future.
With deep expertise and extensive experience, we deliver precise and efficient solutions to ensure every project meets the highest standards.
We integrate cutting-edge technology with continuous innovation to develop breakthrough solutions that drive industry progress and create lasting value for our clients.
We offer round-the-clock premium support services, ensuring rapid response and efficient problem resolution, allowing you to focus on your core business without worries.
