The fully automated temporary bonding system achieves the whole temporary bonding process – starting with temporary adhesive application, baking, alignment and bonding of the device wafer to the carrier wafer – within one automated tool. The equipment layout is modular as with all EVG’s fully automated tools, meaning it can be throughput-optimized depending on the specific process.
Because of EVG’s open platform, different types of temporary bonding adhesives can be used, such as spin coat thermoplast, thermoset materials, or tapes.
| Wafer diameter (substrate size) |
|---|
| Up to 300 mm, oversized carrier possible |
| Different substrate / carrier combinations |
| Configuration |
|---|
| Coat module |
| Bake module with multiple hot plates |
| Align module with optical or mechanical alignment |
| Bond module |
| Options |
|---|
| Inline Metrology |
| ID reading |
| High topography wafer handling |
| Warped wafer handling |
By joining hands and leveraging cutting-edge technologies, we develop innovative solutions to drive societal progress and shape a better future.
With deep expertise and extensive experience, we deliver precise and efficient solutions to ensure every project meets the highest standards.
We integrate cutting-edge technology with continuous innovation to develop breakthrough solutions that drive industry progress and create lasting value for our clients.
We offer round-the-clock premium support services, ensuring rapid response and efficient problem resolution, allowing you to focus on your core business without worries.
