The GEMINI is a state-of-the-art, fully automated production wafer bonding system that integrates wafer-to-wafer alignment and bonding processes in a modular design. This platform is particularly suited for next-generation MEMS (Micro-Electro-Mechanical Systems) manufacturing up to 300 mm, offering exceptional performance in wafer-level vacuum or overpressure encapsulation but also in advanced system integration. Based on the global industry standard for high-volume-manufacturing (HVM) wafer bonding, the GEMINI equipment platform includes up to four bond chambers that ensure excellent bond quality and yield. The equipment provides full flexibility and supports a wide range of processes, including metal, anodic, glass-frit, fusion, and adhesive bonding.
200 mm GEMINI®
300 mm GEMINI®
By joining hands and leveraging cutting-edge technologies, we develop innovative solutions to drive societal progress and shape a better future.
With deep expertise and extensive experience, we deliver precise and efficient solutions to ensure every project meets the highest standards.
We integrate cutting-edge technology with continuous innovation to develop breakthrough solutions that drive industry progress and create lasting value for our clients.
We offer round-the-clock premium support services, ensuring rapid response and efficient problem resolution, allowing you to focus on your core business without worries.
