The field of electronics, semiconductor processing, and medical instrument manufacturing is witnessing a trend of progressive miniaturization. This trend is characterized by the production of increasingly smaller structures, while at the same time, there is a growing demand for the highest level of precision in terms of surface quality, absence of burr, and materials residues. Traditional fabrication technologies are increasingly facing limitations in meeting these demands; however, laser micromachining provides optimal conditions for achieving the required quality and precision. This is because laser micromachining is a contactless process, and the extent of the heat-affected zone is very small.
Classical areas of applications for laser micromachining lie within the ambit of the laser micro drilling, laser fine cutting, laser micro structuring and the laser micro engraving. Moreover, innovative laser separation processes such as TLS-Dicing or laser ablation processes for the manufacturing of cylindrical holes, undercut geometries or molds are finding their way into the industrial production.
3D-Micromac has introduced laser-based sample preparation, which opens up new possibilities for laser micromachining. This technology offers patented workflows for TEM analysis, X-ray microscopy, atom probe tomography, and micromechanical testing, complementing existing methods of sample preparation, such as focused ion beam (FIB) micromachining. Laser-based sample preparation provides up to 10,000 times higher ablation rates, resulting in significantly lower cost of ownership (CoO) when compared to FIB.
In additive manufacturing, Micro Laser Sintering combines the advantages of 3D printing and micro machining for the first time. Micro metal parts of incredible accuracy, detail resolution and surface quality are manufactured this way.
3D-Micromac‘s highly versatile microFLEX product family is the all-in-one solution for all-inclusive solution for laser processing of flexible thin-films in photovoltaics, electronics, medical devices, displays, and semiconductors.
The production systems can handle various substrates, material thicknesses, and types such as polymer films, stainless steel, and thin glass.
The microFLEX systems combine high-precision laser processing with cleaning and packaging technologies as well as inline quality control. Due to its modular concept, various customized solutions are available, reaching from industrial mass production to pilot lines as well as applied research.
By joining hands and leveraging cutting-edge technologies, we develop innovative solutions to drive societal progress and shape a better future.
With deep expertise and extensive experience, we deliver precise and efficient solutions to ensure every project meets the highest standards.
We integrate cutting-edge technology with continuous innovation to develop breakthrough solutions that drive industry progress and create lasting value for our clients.
We offer round-the-clock premium support services, ensuring rapid response and efficient problem resolution, allowing you to focus on your core business without worries.
