3D-Micromac’s microMIRA LLO system provides highly uniform, force-free lift-off of different layers on wafers at high processing speed. The unique line beam system is built on a highly customizable platform that can incorporate different laser sources, wavelengths and beam paths to meet each customer’s unique requirements.
The laser system can be used for a variety of applications, such as GaN lift-off from glass and sapphire substrates in microLED display manufacturing as well as in semiconductor manufacturing.
Additional applications include laser annealing and crystallization for surface modification.
By joining hands and leveraging cutting-edge technologies, we develop innovative solutions to drive societal progress and shape a better future.
With deep expertise and extensive experience, we deliver precise and efficient solutions to ensure every project meets the highest standards.
We integrate cutting-edge technology with continuous innovation to develop breakthrough solutions that drive industry progress and create lasting value for our clients.
We offer round-the-clock premium support services, ensuring rapid response and efficient problem resolution, allowing you to focus on your core business without worries.
