The microPRO XS OCF system provides laser annealing with high repeatability and throughput in a versatile system. Combining a solid laser optic module with 3D-Micromac’s modular processing platform, the microPRO XS is ideally suited for ohmic contact formation (OCF) for power devices based on silicon carbide (SiC).
The microPRO XS OCF features a UV-wavelength diode-pumped solid-state (DPSS) laser source with nano-second pulses and spot scanning to process the entire metalized backside of SiC wafers. Sophisticated process routines and an optimized chamber layout reduce particle generation. Individual adjustable laser spot profiles enable the processing of different material compositions.
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