The microVEGA FC system performs high-throughput laser microprocessing for different applications in the semi-industry. The system combines high-precision processes with high dynamics. Therefore, possible applications include:
Thanks to its highly flexible tool configuration, the microVEGA FC can accommodate both 200-mm and 300-mm wafers at processing speeds of up to 400 mm/s – making it an ideal production solution in terms of cost, throughput, yield, and sensitivity.
The microVEGA FC uses a laser spot in the single-digit micrometer range that moves continuously over semiconductor wafers. During this motion, the laser selectively processes defined microstructures at high speeds. The small size of these structures (approximately 1-2 μm) necessitates a high three-dimensional positioning accuracy of the laser spot in relation to the structures. Therefore, the microVEGA FC includes an integrated measuring technology to achieve 100 percent process control.
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