Features:
Equipment characteristics
Low plasma damage on the wafer surface;
High vacuum transfer platform for better particle control;
Supports PR strip of normal thickness wafers and Taiko thin wafer wafers;
High PR strip rate, high production throughput, and long MTBC;
Develop software based on Windows operate system, with a friendly UI interface;
Process application
Wafersize: 4/6/8 inches wafer
Applicable materials: photoresist, PI
Applicable fields: Integrated circuits, power semiconductors, compound semiconductors,scientific research, etc
By joining hands and leveraging cutting-edge technologies, we develop innovative solutions to drive societal progress and shape a better future.
With deep expertise and extensive experience, we deliver precise and efficient solutions to ensure every project meets the highest standards.
We integrate cutting-edge technology with continuous innovation to develop breakthrough solutions that drive industry progress and create lasting value for our clients.
We offer round-the-clock premium support services, ensuring rapid response and efficient problem resolution, allowing you to focus on your core business without worries.